HOME > Research Institute of Technology > Molding Technology Center
Molding Technology Center designs and makes
a variety of products ranging from ultra-precision
thin molds to large automobile molds.
Core Technologies
Core TechnologiesMain Engineering Techniques
Main Engineering TechniquesEquipment Information
Equipment InformationThis molding technology is applied to make ultra-precise, delicate, and small parts products with 0.10um of tolerance, such as Lead Frame, Semiconductor, and Shield Can parts.
This molding technology makes it possible to implement the press technique of transferring multiple processes sequentially for continuous work, and to maximize productivity through the improvement in innovative processing efficiency. Compared to the one-process based molding technique, the progressive molding technique can greatly increase an output in a stable way and improve quality at the same time.
This molding technique is applied to mold a container with a certain seamless shape by imposing the front axis force on a plate with the use of the equal-shaped punch and die. It is used to make a drum, a cylinder with angles, or other complex shapes.
Wire Cutter Machine
Surface Grinder Machine
Equipment | Model | Quantity | Remarks |
---|---|---|---|
Press | CS-200 | 2 | 200T, 5T |
Wire Cutter M/C | AG400/600L | 4 | ¢0.1 ~ ¢0.3 |
Super Drilling M/C | NSD600TG | 1 | ¢0.3 ~ ¢3.0 |
Milling M/C | HMT-1100 | 1 | |
Lathe M/C | NARA-4300 | 1 | |
Band Saw M/C | HV-400N | 1 | |
Surface Grinding M/C | YGS-116A | 1 | |
Forming Surface Grinding M/C | DFG-250MB | 2 | |
Bench Drill | 2 |